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  • Multi Layer
  • FORCM is leading changes through continuous innovation and creativeness.
  • Rigid Multi layer PCB
  • Multi-layer PCB is devised for the compact but high performance products by integrating circuits into smaller space, which cannot be on double layer PCB.

    It composes various micro holes and connects layers by penetrating necessary layers and improves efficiency innovatively comparing to existing double layer circuit board.
  • Manufacturing Specifications
  • ITEM Rigid-Double
    Min. Pattern / Width space 100/100㎛
    Min. Hole Diameter Mechanical Φ0.25
    Max. Layer Count ~12Layer
    Board Thickness 0.4 ~ 2.0mm
    Copper Clad Min. 1/3 oz(12㎛)
    Max. 2 oz(70㎛)
    Plating Min Thickness 20 ± 5㎛
    Materials
    FR-4 / High Tg
    Halogen Free
    Other
    Surface treatment OSP 0.3 ~ 0.45㎛
    HASL Land : 2 ~ 80㎛ / Edge : 2 ~ 25㎛
    Chemical Gold Ni : 3.0㎛ / Au : 0.03㎛
    Other -
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